Defining a Thermoelectric Cooler Component

You can apply properties to a 3D part that model the behavior of a thermoelectric cooler (TEC).

When you define a TEC component in one finite element model (FEM) representation, the app defines it in all FEM representation instances.

Before you begin:
  1. Create a bounding box abstraction to represent the TEC, instead of using the detailed heat sink geometry.

    For more information, see Creating Abstraction Shapes.

  2. Mesh the bounding box.
  3. Add the bounding box to the simulation.
See Also
About Thermoelectric Cooler Components
  1. From the E-Cooling section of the action bar, click TEC Component .
  2. Optional: Enter a descriptive Name.
  3. From the 3D area, select a bounding box as the support.
  4. From the 3D area, select the cold side of the TEC.

    The cold side of the TEC is usually closest to the heat source.

  5. From the 3D area, select the hot side of the TEC.

    The hot side of the TEC is usually farthest from the heat source.

  6. Enter a value for the Maximum temperature difference supported, which is the maximum temperature difference between the cold and hot sides of the TEC for the device to be effective.
  7. Enter a value for the Voltage at device current maximum, which is the electric potential of the TEC's circuit at the maximum supported input current.
  8. Enter a value for the Maximum current for device effectiveness, which is the maximum current at which the device remains effective.
  9. Enter a value for the Geometry factor, which is the average area-to-height ratio of the semiconductor pellets inside the TEC.
  10. Enter a value for the Number of thermocouples, which is the total number of n- and p-type semiconductor pellet pairs.

    One thermocouple consists of one p-type pellet and one n-type pellet.

  11. Click OK.