Anand Model

The Anand creep model defines creep using strain rate and temperature. It is well suited for modeling the behavior of solder alloys used in electronic packaging. In addition, it produces accurate results for a wide range of temperatures and strain rates.

The Anand model is available in the form

ε˙cr=A[sinh(ξq~s)]nexp(QR(θθZ)),
where
ε˙cr
is the uniaxial equivalent creep strain rate, 23ε˙cr:ε˙cr,
q~
is the uniaxial equivalent deviatoric stress,
R
is the universal gas constant,
θ
is the temperature,
θZ
is the user-defined value of absolute zero on the temperature scale used,
Q
is the activation energy,
s
is the deformation resistance, and
A, m, and ξ
are material parameters.

The evolution equation for the deformation resistance, s (initially s=s0), is

s˙=h0|1ss*|asign(1ss*)ε˙cr,
with
s*=s^[1Aε˙crexp(QR(θθZ))]n,
where
h0=A0+A1(θθZ)+A2(θθZ)2+A3ε˙cr+A4(ε˙cr)2,
and a, n, s^, A0, A1, A2, A3, and A4 are material parameters.

In addition, the initial deformation resistance is a function of temperature of the form

s 0 = S 1 + S 2 ( θ θ Z ) + S 3 ( θ θ Z ) 2 ,
where S 1 , S 2 , and S 3 are the material parameters.