Problem DescriptionThe PCB assembly has a motherboard that is 247 mm long, 146 mm wide, and 2.5 mm tall. The motherboard houses three small capacitors, a power supply (battery), a heat source (main chip), a heat sink, and two small PCBs housing eight small chips. The power supply is connected to the motherboard by point fasteners, while the rest of the parts are connected to the motherboard by tie connections. The heat sink is made of aluminum, an isotropic and linearly elastic material with a Young's modulus of 70 GPa, Poisson's ratio of 0.35, and density of 2700 kg/m³. The heat source is made of polyimide, an isotropic and linearly elastic material with a Young's modulus of 1.8 GPa, Poisson's ratio of 0.25, and density of 2340 kg/m³. The rest of the parts are PCB substrate, an isotropic and linear elastic material with a Young's modulus of 1.8 GPa, Poisson's ratio of 0.25, and density of 2340 kg/m³. ![]()
WorkflowThe workflow diagram below provides an overview of the example. The diagram shows the apps that you use as you perform the steps in sequence. Clicking a number in the diagram opens its corresponding step in the example. ![]()
Complete the workflow steps in the order in which they are listed. Deviation from the instructions associated with each step might cause model or scenario errors, which might prevent convergence of the simulation. |