Problem DescriptionThis example models the heat generated by a CPU chip attached to a heat sink on a printed circuit board. The board is enclosed by a case and cooled by a fan. The case is 200 mm x 100 mm x 40 mm and is modeled as a thin surface. The fan blows air into the case through an inlet, and the air exits the case from five small vents on each side of the enclosure. The air is assumed to have a thermal conductivity of 0.025 W/mK, a specific heat of 1005 J/Kkg, a density of 1.25 kg/m3, and a viscosity of 1.8e-5 Ns/m2. The aluminum heat sink consists of 21 uniformly spaced fins with an aspect ratio X/L (X = spacing between the fins, L = height of each fin) = 1/11. The aluminum has isotropic material properties—a thermal conductivity of 237 W/mK and a specific heat of 910 J/Kkg. The heat source is a 50-mm x 50-mm x 5-mm silicon CPU chip. The chip has isotropic material properties—a thermal conductivity of 149 W/mK and a specific heat of 710 J/Kkg. ![]()
WorkflowThe workflow diagram below provides an overview of the example. The diagram shows the apps that you use as you perform the steps in sequence. Clicking a number in the diagram opens its corresponding step in the example. ![]()
Complete the workflow steps in the order in which they are listed. Deviation from the instructions associated with each step might cause model or scenario errors, which might prevent convergence of the simulation. |